Semiconductors, OLEDs and perovskites
Controlled atmosphere glove box solution
TENCAN provides products for semiconductors and OLEDs The controlled atmosphere glove box system developed and mass-produced with perovskite helps customers achieve a low-water-oxygen, low-particle, stable and controllable process environment, and provides integrated support from laboratory to pilot and mass production for the manufacturing of sensitive materials and precision devices.
Semiconductor
OLED
Perovskite
Industry pain points and challenges
Water and oxygen sensitivity
Semiconductors, OLEDs and perovskite materials are extremely sensitive to moisture and oxygen, and trace amounts of contamination can lead to performance degradation, packaging failure or shortened lifespan.
Particles and pollution
Particle, organic matter and metal ion contamination will affect film uniformity, interface quality and electrical performance, and must be controlled within a clean and traceable range.
The process environment is unstable
Temperature and humidity fluctuations, atmosphere leakage and uneven ventilation will directly affect the consistency and reproducibility of deposition, evaporation, packaging and testing.
Scale and consistency
From R&D to mass production, equipment requires higher stability, traceability, and batch-to-batch consistency, and verification and maintenance costs also increase.
Compliance and Security
The operation of inert gas, vacuum modules and sensitive materials requires taking into account system sealing, safety protection, operation and maintenance efficiency and industry standard requirements.
Key control variables
Dew point (H₂O)
Oxygen content (O₂)
Cleanliness
Positive pressure
Air exchange rate
Application process (typical process steps)
How does the glove box system support the solution
Low water and low oxygen environment
Maintain stable dew point ≤ -80 ℃ and oxygen content ≤ 0.1 ppm, effectively inhibiting the degradation and side reactions of water and oxygen on sensitive materials.
Clean production environment
Supports ISO Class 3 cleanliness control to reduce particle and organic contamination and ensure device yield and consistency.
Device packaging protection
Complete packaging and sealing in an inert atmosphere to block water and oxygen intrusion, extend device life and improve stability.
Device integration and connection
Supports online integration of evaporation, measurement, ALD, cleaning, testing and other equipment to form a complete process solution.
The process is stable and controllable
Precisely control pressure, air exchange times and gas purity to ensure that the process is repeatable, traceable and optimizable.
From materials to devices, one-stop inert atmosphere solution
TENCAN provides customized glove box systems and process integration services to help customers in the semiconductor, OLED and perovskite fields achieve higher yields and faster R&D iterations.
Recommended system and configuration
Provide efficient and reliable glove box system configuration solutions for different application scenarios, supporting multi-level deployment from laboratory research and development to pilot testing and mass production.
| Application scenarios | Semiconductor High purity process and packaging |
OLED Evaporation and packaging |
Perovskite R&D and pilot testing |
|---|---|---|---|
| Typical process | Wafer packaging / MEMS / power devices | Evaporation / packaging / device testing | Material synthesis/device preparation/packaging testing |
| Oxygen content (O₂) | ≤ 0.1 ppm | ≤ 0.1 ppm | ≤ 0.5 ppm |
| Water content (H₂O) | ≤ 0.1 ppm | ≤ 0.1 ppm | ≤ 1 ppm |
| Dew point | ≤ -80 ℃ | ≤ -80 ℃ | ≤ -60 ℃ |
| Circulation purification system | Efficient oxygen and water removal | Efficient oxygen and water removal | Standard oxygen and water removal |
| System pressure | +10 ~ +30 Pa | +5 ~ +20 Pa | +5 ~ +20 Pa |
| Recommended models | TG-SEM series | TG-OLED series | TG-PSC Series |
| Optional modules | Vacuum transfer/rapid transfer cabin | Evaporation interface/electron beam evaporation | Solution processing/spin coating module |
| Applicable scale | Mass production/pilot trial | Mass production/pilot trial | R&D/pilot scale |
Customized services
We can provide personalized system design and configuration solutions based on process requirements, site conditions and budget, and support non-standard customization and modular expansion.
Contact us for customized solutionsApplication cases
Advanced packaging solution platform
Create a chip-level packaging platform in a low water and oxygen environment for a head packaging company to achieve stable process conditions and higher consistency of finished products.
View detailsOLED thin film packaging production line
Integrate process units such as evaporation, packaging and aging testing, and are compatible with multi-size substrates to meet the mass production needs of high-end display devices.
View detailsPerovskite R&D pilot line
Provide a stable and controllable inert environment for perovskite battery R&D and pilot testing, and support the development of key processes such as spin coating, annealing, and packaging.
View detailsElectronic materials glove box platform
Used for research on materials such as lithium batteries/solid electrolytes/metal organic precursors, providing ultra-low water oxygen and high cleanliness experimental environment.
View details